WEARABLE COMPUTER IN A SYSTEM – IN – A – PACKAGE

Wearable computing places tighter constraints on architecture design than traditional mobile computing. The real structure of the computer is much more complicated than the structure of mobile computers. In modern computers, in particular personal computers, there is increasingly a departure from the traditional architecture of von Neumann, due to the desire of developers and users to improve the quality and performance of computers. The quality of a computer is characterized by many indicators. This is a set of commands that the computer is able to understand, and the speed of the CPU, the number of peripheral I / O devices connected to the computer at the same time. The main indicator is the speed – the number of operations that a processor can perform per unit of time. In practice, the user is more interested in the performance of the computer – the indicator of its effective speed, that is, the ability to not just quickly function, but quickly solve specific tasks.The architecture is described in terms of miniaturization, power – awareness, global low – power design and suitability for an application. A system – in – a – package (SiP) generally contains a variety of systems such as analog, digital, high frequency and micro electro mechanical systems, integrated in a system – level package connected through a substrate. In this article we propose a SiP model and the packaging implementation of the SiP as a complete microsystem.

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